Call for Papers
HiPC 2006 FLYER : (PDF)
The 13th annual IEEE International Conference on High Performance Computing (HiPC 2006) will be held in Bangalore, India, during December 18-21, 2006. It will serve as a forum to present the current work by researchers from around the world, and act as a venue to provide stimulating discussions and highlight high performance computing activities in Asia. The conference has a history of attracting participation from reputed researchers from all over the world. In addition to technical sessions consisting of contributed papers, the conference will include invited presentations, a poster session, tutorials, and vendor presentations. Further information about HiPC 2006 and the HiPC series of meetings is available on the conference website at
HiPC 2006 will focus on all aspects of high performance computing. Topics of interest include but are not limited to:
  4 Parallel and Distributed Algorithms
  4 Languages and Programming Environments
  4 Load Balancing, Scheduling and Resource Management
  4 Fault-Tolerant Algorithms and Systems
  4 Scientific/Engineering/Commercial Applications and Workloads
  4 Cluster and Grid Computing
  4 Peer-to-peer Algorithms and Networks
  4 Heterogeneous Computing
  4 Wireless and Mobile Computing
  4 Communication/Sensor Networks and Embedded Applications
  4 Emerging Computer Architectures
  4 Scalable Servers and Systems
  4 Power-Efficient and Reconfigurable Architectures
  4 Compiler Technologies for High-Performance Computing
  4 Operating Systems for Scalable High-Performance Computing
  4 Performance Evaluation and Analysis

Authors are invited to submit original unpublished manuscripts that demonstrate current research in all areas of high performance computing. The proceedings will be published by Springer-Verlag, Lecture Notes in Computer Science, and will be available at the conference.

Best paper awards, sponsored by Infosys, will be given for outstanding contributed papers in two areas: (a) Algorithms and Applications, and (b) Systems.

Manuscripts may not exceed 15 double-spaced pages of text using 12 point size font on 8.5 x 11 inch pages with margins of at least 1 inch on each of the four sides. References, figures, tables, etc. may be included in addition to the fifteen pages of text. Manuscripts should be in English and structured as technical papers. (helpful information on writing technical papers is given below)

All manuscripts should be submitted via EDAS, a web-based manuscript submission system, by May 12, 2006. Submissions received after the due date will not be accepted. Manuscript submission must be in the form of a readable PDF file. Submissions exceeding the page limit, formatted with smaller font or too narrow page margins, or not appropriately structured may be rejected without review. Also, manuscripts containing significant content that has been published or has been submitted for publication elsewhere will be rejected without review.

All manuscripts will be reviewed and judged on correctness, originality, technical strength, significance, quality of presentation, and interest and relevance to the conference attendees. Notification of review decisions will be mailed by July 14, 2006. Camera-ready papers are due by August 18, 2006. Authors may contact the Program Chair for further information or clarification.
Program Chair: Yves Robert, ENS Lyon, France

Suggestions and resources for writing technical papers:
Writing Resources:
Suggestions to write technical papers:

April 05, 2006 Paper Submission Begins
May 12, 2006 Paper Submission Ends
May 12, 2006 Workshop Proposals Due
May 19, 2006 Tutorial Proposals Due
July 14, 2006 Notification of Acceptance/Rejection
August 18, 2006 Camera-Ready Paper Submission
October 06, 2006 Poster/Presentation Summary Due
October 25, 2006 Notification to Authors for Posters
November 07, 2006 Last Day for Advance Registration

  Manish Parashar, Rutgers Univ., USA
Ramamurthy Badrinath, HP, India
  Rajendra V. Boppana, Univ. of Texas, San Antonio USA
Rajeev Muralidhar, Intel, India
  David A. Bader, Georgia Inst. of Tech., USA
Ramamurthy Badrinath, HP, India
Frank Baetke, HP, USA
R. Govindarajan, Indian Inst. of Science, India
Harish Grama, IBM, India
Vittal Kini, Intel, India
N. S. Nagaraj, Infosys, India
Viktor K. Prasanna, Univ. of Southern California, USA (Chair)
Venkat Ramana, Cray-Hinditron, India
Sartaj Sahni, Univ. of Florida, USA
Dheeraj Sanghi, Indian Inst. of Tech., Kanpur, India
V. Sridhar, Satyam Computer Services Ltd., India
Harrick M. Vin, Tata Research, Development and Design Center(TRDDC), Pune, India
  Yves Robert, ENS Lyon, France
  Algorithms: Srinivas Aluru, Iowa State Univ., USA
  Applications: John Morrison, Univ. College, Cork, Ireland
  Architecture: Bradley Kuszmaul, Massachusetts Inst. of Tech., USA
  Communication Networks: Yuanyuan Yang, State Univ. of New York at Stony Brook, USA
  Mobile and Sensor Computing: Stéphane Ubéda, INSA Lyon, France
  Systems Software: Sanjay Rajopadhye, Colorado State Univ., USA
    Mikhail Atallah, Purdue Univ., USA
David A. Bader, Georgia Inst. of Tech., USA
Robert Germain, IBM Watson Research Center, USA
Ananth Grama, Purdue Univ., USA
Phalguni Gupta, IIT Kanpur, India
Bruce Hendrickson, Sandia National Lab., USA
Alex Pothen, Old Dominion Univ., USA
Sanguthevar Rajasekaran, Univ. of Connecticut, USA
Abhiram Ranade, IIT Mumbai, India
Andrew Rau-Chaplin, Univ. of Dalhousie, Canada
Oliver Sinnen, Univ. of Auckland, New Zealand
Pavlos Spirakis, Univ. of Patras, Greece
Srikanta Tirthapura, Iowa State Univ., USA
Denis Trystram, ID-IMAG Grenoble, France
    Brian Coghlan, Trinity College, Dublin, Ireland
Simon Dobson, Univ. College, Dublin, Ireland
James Doherty, Univ. College, Cork, Ireland
Bernd Freisleben, Univ. of Marburg, Germany
George Gravvanis, Democritus Univ. of Thrace, Greece
Vipin Kumar, Univ. of Minnesota, USA
Alexey Lastovetsky, Univ. College, Dublin, Ireland
Hyunyoung Lee, Univ. of Denver, USA
Ami Marowka, Shenkar College of Engineering and Design, Israel
Esmond G. Ng, Lawrence Berkeley National Lab., USA
Marcin Paprzycki, Oklahoma State Univ., Tulsa, USA
Adarsh Patil, Univ. College, Cork, Ireland
Dana Petcu, Western Univ. of Timisoara, Romania
Omer Rana, Cardiff Univ., UK
Joel Saltz, Ohio State Univ., USA
Matthew Smith, Univ. of Marburg, Germany
Marek Tudruj, Polish-Japanese Inst. of Information Tech., Warsaw, Poland
    Srini Devadas, Massachusetts Inst. of Tech., USA
Sandhya Dwarkadas, Univ. of Rochester, USA
Kanad Ghose, SUNY Binghamton, USA
Andy Glew, Intel, USA
Sebastien Hily, Intel, USA
Mahmut Kandemir, Penn State Univ., USA
Christos Kozyrakis, Stanford Univ., USA
Sanjeev Kumar, Intel, USA
Milo Martin, Univ. of Pennsylvania, USA
Pierre Michaud, IRISA Rennes, France
Yanos Sazeides, Univ. of Cyprus, Cyprus
Hans Vandierendonck, Univ. of Ghent, Belgium
Craig Zilles, Univ. of Illinois at Urbana-Champaign, USA
  Communication Networks
    Jiannong Cao, Hong Kong Polytechnic Univ., China
Kartik Gopalan, Florida State Univ., USA
Lisandro Granville, Federal Univ. of Rio Grande do Sul, Brazil
Qianping Gu, Simon Fraser Univ., Canada
Mathieu Latapy, LIAFA Paris, France
Xing Li, Tsinghua Univ., China
Bin Liu, Tsinghua Univ., China
Olav Lysne, Simula Research Lab., Univ. of Oslo, Norway
Yavuz Oruc, Univ. of Maryland at College Park, USA
Mohamed Ould-Khaoua, Univ. of Glasgow, UK
Andrzej Pelc, Univ. du Quibec en Outaouais, Canada
Congduc Pham, Univ. de Pau, France
Greg Plaxton, Univ. of Texas at Austin, USA
Jang-Ping Sheu, National Central Univ., Taiwan
Jingyuan Zhang, Univ. of Alabama, USA
  Mobile and Sensor Computing
    Demet Aksoy, Univ. of California, Davis, USA
Sajal K. Das, Univ. of Texas at Arlington, USA
Marcelo Dias de Amorim, LIP6 Paris, France
Erol Gelembe, Imperial College, London, UK
Sandeep K. S. Gupta, Arizona State Univ., USA
Fredrik Manne, Univ. of Bergen, Norway
Rajeev Muralidhar, Intel, India
Michael Neufeld, BBN Technologies, USA
Sotiris Nikoletseas, Computer Tech. Inst. Patras, Greece
Thomas Noel, Univ. de Strasbourg, France
Stephan Olariu, Old Dominion Univ., USA
Christian Prehofer, DoCoMo Euro-Labs, Munich, Germany
Pedro Ruiz, Univ. of Murcia, Spain
Stefan Weber, Trinity College, Dublin, Ireland
Yang Yu, Motorola Research Lab., USA
  Systems Software
    Rumen Andonov, INRIA Rennes, France
Eduard Ayguade, UPC, Barcelona, Spain
Scott Baden, UCSD, San Diego, USA
Pedro Diniz, USC-ISI, Marina Del Rey, USA
Ramaswamy Govindarajan, IISC, Bangalore, India
Manish Gupta, IBM Yorktown Heights, USA
Ben Juurlink, Delft Univ. of Tech., Netherlands
Uday Khedker, IIT Mumbai, India
Mitsuhisa Sato, Tsukuba Univ., Japan
Siang Wun Song, Sao Paolo Univ., Brazil
Michelle Strout, Colorado State Univ., USA
Chau-Wen Tseng, Univ. of Maryland at College Park, USA
Frédéric Vivien, INRIA and ENS Lyon, France
Cho-Li Wang, Hong Kong Univ., China
Jingling Xue, Univ. of New South Wales, Sydney, Australia
  Sumir Chandra, Rutgers Univ., USA
Viraj Bhat, Rutgers Univ., USA
  Ajay Gupta, Western Michigan Univ., USA
B. V. Ramachandran, Software Tech. Park, Bangalore, India
  Ch. Kalyana Krishna, Dell Product Group, India
  Sushil K. Prasad, Georgia State Univ., USA
  Rajeev R. Raje, Indiana Univ. Purdue Univ., USA
Bo Hong, Drexel Univ., USA
Manisha Dhanke, IBM India Software Labs, India
  Susamma Barua, California State Univ., Fullerton, USA

Proposals are solicited for workshops to be held in conjunction with the main conference. Interested individuals should submit a proposal by May 12, 2006 to the Workshops Chair. For additional details and submission guidelines, visit HiPC 2006.
Workshops Chair: Manimaran Govindarasu, Iowa State Univ., USA

In addition to the contributed papers session, a plenary poster/presentation session emphasizing novel applications of high performance computing is planned. It will offer brief presentation time for each poster and will be followed by a "walk-up and talk" setting. To be considered, send a 5 page summary of your work to the Poster/Presentation Chair by October 6, 2006. For additional details, contact the Poster/Presentation Chair.
Poster/Presentation Chair: Rajeev Thakur, Argonne National Laboratory, USA

Proposals are solicited for tutorials to be held at the meeting. Interested individuals should submit a proposal by May 19, 2006 to the Tutorials Chair. The proposal should include a brief description of the intended audience, a lecture outline, and a vita for each lecturer. For additional details, contact the Tutorials Chair.
Tutorials Chair: Rama K. Govindaraju, IBM, USA

Companies and R&D laboratories are encouraged to present their exhibits at the meeting. In addition, a full day of vendor presentations is planned. Further details can be obtained by contacting the industry liaison co-chairs, Vijay Mann and Raghuram Tupuri.
Industry Liaison Co-Chairs: Vijay Mann, IBM, India & Raghuram Tupuri, AMD, India

HiPC 2006 will be awarding travel scholarships to students from Indian Engineering Colleges to encourage them to attend the conference. This merit-based scholarship will cover their travel and accommodation expenses. The last date of application is October 31, 2006. For further details, contact the Scholarships Co-Chairs.
Scholarships Co-Chairs: Anu G. Bourgeois, Georgia State University, USA & Madhusudhan Govindaraju, SUNY Binghamton, USA