Industry Participation

The HiPC conference series has a strong relationship with industry, both within India and internationally, including industry involvement in its steering and organizing committees. The conference welcomes (and strongly encourages) industry participation are all levels including in the technical program, the student symposium, and especially in the industry, research and user symposium and vendor exhibition. Details about these and other events in the past years in the conference are available at the conference website at hipc.org. Various sponsorship opportunities are also available as listed below. Sponsors are also encouraged to participate in defining the industry, research and user symposium events.

Companies and R&D laboratories are encouraged to present their exhibits at the meeting. The following sponsorship levels are available.

I. Platinum Level, INR 500,000 (US$12000)

  • Participate in the definition of one of the industry, research and user symposium sessions (best practices)
  • Speaking slot in the Conference reception
  • Can invite 10 customers, business partners with complementary registration for the conference
  • 10 complementary conference registrations for their own employees
  • Literature distributed with the conference registration kit
  • Large-size logo on conference website and publicity materials**
  • Large booth at the conference exhibition

II. Gold Level, INR 300,000 (US$7000)

  • Participate in the definition of one of the user sessions
  • 5 complimentary conference registrations for business partners, customers
  • 5 complementary conference registrations
  • Literature distributed with the conference registration kit
  • Logo on conference website and publicity materials**
  • Small booth at the conference exhibition (with option to reserve a large booth for additional cost)

III. Exhibitor Level, INR 100,000 (US$2500)

  • Logo on website
  • 2 complementary exhibition day registrations - restricted to the exhibition floor
  • One complimentary registration for full conference
  • Small booth at the conference exhibition

Additional sponsor opportunities (Please contact HiPC Industry Co-chairs for details)

  • Student symposium best paper awards [sponsored by Ansys]
  • Student travel awards
  • Conference banquet and cultural event
  • Conference Reception and Student Symposium Poster Exhibits
  • Registration kit

** Logos will be placed on the conference website and on the banner in the conference hall. Further details on industry sessions, exhibits, sponsorship information can be obtained contacting the Industry Liaison co-chairs.

Industry Liaison Co-Chairs

Ramamurthy Badrinath, HP, India
Milind Bhandarkar, EMC, USA
Jigar Halani, Wipro, India
industry AT hipc.org